Low Pressure Magnetron Sputtering by using Extremely Strong Magnetic Field and Coverage Properties of Copper Films Grown as Advanced Seed Layer

H. Hazama, T. Matsuda, Y. Yanagi, A. Sekiguchi, U. Mizutani, K. Sakurrnai, Y. Itoh, H. Ikuta, T. Yamazaki, M. Hori, and A. Imai
Advanced Metallization Conference 2003 (2003).
Advanced Metallization Conference 2003: 13th Asian Session, Sep. 29-30, Oct. 1, 2003, Sanjo Conferene Hall, Univ. of Tokyo, Tokyo